R&D Project 1:
Integration of a low-mass large-area silicon micro-strip detector system for particle tracking
Research Objective
The project aims at the system integration of a low-mass large-area silicon micro-strip detector for particle tracking. Particular focus is on the development of a high-density front-end electronics board for the readout of an ultra-light large-area silicon micro-strip tracker. The activities include an exploration of technologies suitable for a mass-production of the boards, the definition of procedures and tools for their assembly into tracking detector modules, and the definition of procedures for the module integration into the mainframe/thermal enclosure of the CBM micro-strip tracking system.
Participants
GSI Darmstadt (
J. Heuser, activity leader),
SE SRTIIE Kharkov (V. Borshchov),
INR Kiev (V. Pugatch)
Tasks
Task Nr. |
Task name |
Participants |
P1/T1 |
Provision of ultra-light Aluminum-Kapton cables |
GSI, SE SRTIIE |
P1/T8 |
Procedures for mass-production and integration of FEBs |
GSI, SE SRTIIE, INR |
P1/T2 |
High-density input patterns on various FEB substrates |
GSI |
P1/T3 |
Investigation and selection of FEB substrates |
GSI, SE SRTIIE |
P1/T4 |
Demonstrator FEB with several CBM-specific chips |
GSI |
P1/T5 |
Demonstrator FEB with full integration of services |
GSI |
P1/T6 |
Fully integrated FEB including high-density input stage |
GSI |
P1/T7 |
Evaluation of the FEBs on test stands |
GSI, SE SRTIIE, INR |
Timeline
Tasks |
2012 |
2013 |
2014 |
Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
Procedures for mass-production + integration |
X |
X |
X |
X |
X |
X |
X |
X |
X |
X |
X |
3 |
Development of a high-density input stage |
X |
X |
X |
1 |
|
|
|
|
|
|
|
|
Demonstrator of a fully integrated FEB |
X |
X |
X |
X |
X |
X |
X |
2 |
|
|
|
|
Milestones:
- Front-end board with high-density input stage
- Fully integrated front-end board with input stage and services
- Procedures for mass-production and integration into the detector system
Deliverable
Report on full-size high-density front-end board compatible with the integration requirements into the CBM silicon micro-strip tracking system, in a technology available for mass-production.
Jump to
--
JohannMHeuser - 31 Jan 2012