R&D Project 3:
Integration of a flexible, silicon embedded CMOS pixel sensor assembly into a prototype ladder for micro-vertex detection
Research Objective
The integration of a flexible, silicon embedded CMOS sensor assembly into a prototype pixel ladder for microvertex detection is the reseach objective of this task. The technical tasks to achieve include the high-precision placement of the active part of the detector onto a support structure, achieving excellent heat evacuation and sufficient rigidity, and the evaluation of technologies allowing to reduce the inactive area between individual sensor chips. A alternative approach is planned to be explored as a fallback solution if the new technology will not be available in time.
Participants
GUF Frankfurt (
J. Stroth, activity leader),
IMEC Leuven (P. De Moor)
Tasks
Task Nr. |
Task name |
Participants |
P3/T1 |
Evaluation of mechanical + electrical properties embedded chip assembly. |
GUF, IMEC |
P3/T5 |
Integration of the prototype assembly into the detector ladder |
GUF, IMEC |
P3/T2 |
Study of suitability for operation in vacuum and under cryogenic operation. |
GUF |
P3/T3 |
Preparation of CVD diamond or TPC/RVC compound support structures |
GUF |
P3/T4 |
Design of the prototype chip assembly |
GUF, IMEC |
Timeline
Tasks |
2012 |
2013 |
2014 |
Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
Q1 |
Q2 |
Q3 |
Q4 |
Integration of prototype assembly on detector ladder |
X |
X |
X |
X |
X |
X |
X |
X |
X |
X |
X |
3 |
Evaluation of the mechanical and electrical properties |
X |
X |
X |
1 |
|
|
|
|
|
|
|
|
CVD diamond or TPC/RVC compound support structures |
X |
X |
X |
X |
X |
X |
X |
2 |
|
|
|
|
Milestones:
- Evaluation of the mechanical and electrical properties
- Preparation of CVD diamond or TPC/RVC compound support structures
- Integration of the prototype assembly to the detector ladder
Deliverable
Report on the performance of the prototype ladder under test beam. Summary of design
specifications and guidelines for the design of the final micro vertex detector.
Jump to
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JohannMHeuser - 16 Feb 2009